Solders for soldering units and HAL devices
Tin and solder binder for special applications

Grade
1 – Sn 97%Ag 3%
2 – Sn 97% Bi 3%
3 – Sn 99% Cu 1%
4 – Sn 99,95%
5 – Sn 63% Pb 37%
Filler metal in pigs or slabs for HAL devices or soldering units in the nitrogen atmosphere, double refined.
Advantages: high flowability during blow and low “halo” temperature, shiny and even pads under the print-applied soldering paste. Minimum consumption, minimum amount of rejects, short-circuits and icicles.
Packing: a carton containing 20 kg of filler metal in 1-kg slabs or 3.5 kg pigs with a hanging hole.